| Process | Control Parameter | Process Capability | |
|---|---|---|---|
| Etching | Line Width / Air Gap | S/S | 0.065mm / 2.5mils |
| D/S & Multilayer | 0.075mm / 3 mils | ||
| Drilling | Min dia 0.15mm | +/- 0.03mm | |
| Min Annual Ring dia 0.50mm | +/- 0.10mm / 4 mils | ||
| “Soft Tool | |||
| (Prototype)” | Hole to Edge | +/- 0.20mm / 8 mils | |
| Edge to Edge | +/- 0.20mm / 8 mils | ||
| Circuit to Edge | +/- 0.20mm / 8 mils | ||
| “Hard Tool | |||
| (Mass Production)” | Hole to Hole | +/- 0.05mm / 2 mils | |
| Edge to Edge | +/- 0.05mm / 2 mils | ||
| Hole to Edge | +/- 0.075mm / 3 mils | ||
| Circuit to Edge | +/- 0.075mm / 3 mils | ||
| Coverlay | Coverlay Opening to Circuit | min 0.20 mm / 8 mils | |
| Coverlay Opening to Opening | Drilling | min 0.3mm / 12 mils | |
| Tooling | min 0.5mm / 20 mils | ||
| Coverlay Lay up | +/- 0.20 mm / 8 mils | ||
| Legend | Min Line Width | min 0.125 mm / 5 mils | |
| Legend Spacing | min 0.20 mm / 8 mils | ||
| Material | Description | Thickness | |
| Copper Clad | Copper: RA / ED / HTE | 1/3oz, 1/2oz, 1oz, 2oz, etc | |
| Base: PI / PET | 0.5mil, 1mil, 2mil, etc | ||
| Adhesive-less Copper | 1/3oz, 1/2oz, 1oz, etc | ||
| Coverlay Film | Film: PI / PET | 0.5mil, 1mil, 2mil, etc | |
| Adhesive Thickness | 15um, 25um, 35um, etc | ||
| Solder Mask / LPISM | “Green / White / Black | ||
| etc” | 15um – 25um | ||
| Stiffener | PI (Polymide) | 3mil, 5mil, 7mil, 8mil, etc | |
| PET (Polyester) | 100um, 188um, etc | ||
| FR2, FR4, Stainless steel, Aluminium, etc | 0.2mm, 0.3mm, 0.4mm, 1.6mm, etc | ||
| PSA | PSA (Pressure Sensitive Area) | 50um, 75um, etc |
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