December 18

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PCB Manufacturing Process Capability

Process Control Parameter Process Capability
Material Cutting Max .Dimension 21.5″ x 24.5″
Inner Layer Min.lin/Space 3.0 mil / 3.0 mil
  Copper Thickness 1/3 – 2oz
  Registration Tolerance +/- 0.05mm
Lamination Press Layer Count 2 – 22 layers
  Thickness 0.4 – 4.0mm
Drilling Min. Hole Diameter 0.2 mm
  PTH Diameter Tolerance +/- 0.05mm
  NPTH Diameter Tolerance +/- 0.025mm
  Aspect Ratio 8:1
Outer Layer Min. Line/Space 3.0 mil / 3.0 mil
  Copper Thickness 1/3 – 4oz
  Registration Tolerance +/- 0.05mm
  Impedance Control +/- 10%
Solder Masking Min.Solder Dam 0.08mm
  Min.Solder Mask Opening 0.05mm
  Registration Tolerance +/- 0.05mm
  Solder Mask Plugging ≦0.55mm
Surface Treatment Enig Ni: 2.5-8.0um;
    Au: 0.025-0.10um
  OSP 0.15-0.3um
  Immersion Tin 0.2 – 0.5um
  Immersion Silver 0.8 – 1.0um
  LF-HASL ≧1.0um
Out-Line Profiling Profile Tolerance +/- 0.10mm
  V-cut Angle Tolerance +/- 3°
  V-cut Remain Thickness Tolerance +/- 0.1mm
Final Product Thickness Tolerrance +/- 10%
  Warpage Tolerrance ≦ 0.5%

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