December 18
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PCB Manufacturing Process Capability
| Process | Control Parameter | Process Capability |
|---|---|---|
| Material Cutting | Max .Dimension | 21.5″ x 24.5″ |
| Inner Layer | Min.lin/Space | 3.0 mil / 3.0 mil |
| Copper Thickness | 1/3 – 2oz | |
| Registration Tolerance | +/- 0.05mm | |
| Lamination Press | Layer Count | 2 – 22 layers |
| Thickness | 0.4 – 4.0mm | |
| Drilling | Min. Hole Diameter | 0.2 mm |
| PTH Diameter Tolerance | +/- 0.05mm | |
| NPTH Diameter Tolerance | +/- 0.025mm | |
| Aspect Ratio | 8:1 | |
| Outer Layer | Min. Line/Space | 3.0 mil / 3.0 mil |
| Copper Thickness | 1/3 – 4oz | |
| Registration Tolerance | +/- 0.05mm | |
| Impedance Control | +/- 10% | |
| Solder Masking | Min.Solder Dam | 0.08mm |
| Min.Solder Mask Opening | 0.05mm | |
| Registration Tolerance | +/- 0.05mm | |
| Solder Mask Plugging | ≦0.55mm | |
| Surface Treatment | Enig | Ni: 2.5-8.0um; |
| Au: 0.025-0.10um | ||
| OSP | 0.15-0.3um | |
| Immersion Tin | 0.2 – 0.5um | |
| Immersion Silver | 0.8 – 1.0um | |
| LF-HASL | ≧1.0um | |
| Out-Line Profiling | Profile Tolerance | +/- 0.10mm |
| V-cut Angle Tolerance | +/- 3° | |
| V-cut Remain Thickness Tolerance | +/- 0.1mm | |
| Final Product | Thickness Tolerrance | +/- 10% |
| Warpage Tolerrance | ≦ 0.5% |
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